MediaTek is set to announce its Dimensity 8300 midrange chipset next week but we now have a Geekbench run for the Redmi 70 which is expected to be amongst the first phones on the market with the new SoC.
Redmi K70 Geekbench scorecard
Redmi K70 (Xiaomi 2311DRK48C) scored 1,512 single-core points and 4,886 multi-core points which is slightly higher than the outgoing Dimensity 8200 and 8200 Ultra. The chip features 1+3+4 architecture with ARMv8-based cores. There’s 1x Cortex-A715 performance core clocked at 3.35GHz alongside 3x Cortex-A715 cores @ 3.32GHz and 4x Cortex-A510 efficiency units @ 2.2GHz. On the GPU side, we have the Mali-G615 MC6 GPU
The listing also reveals the K70 will come with 16GB RAM and boot Android 14, presumably with Xiaomi HyperOS out of the box. Redmi K70 is expected to launch soon but there’s still no official word from Xiaomi. We’re also expecting a K70 Pro model with the Snapdragon 8 Gen 3 chip.
Source
>>> Read full article>>>
Copyright for syndicated content belongs to the linked Source : GSMArena.com – https://www.gsmarena.com/redmi_k70_runs_geekbench_with_upcoming_dimensity_8300_chip-news-60610.php
